By Bangwei Zhang Ph.D.

ISBN-10: 0128026855

ISBN-13: 9780128026854

Amorphous and Nano Alloys Electroless Depositions: expertise, idea, constitution and Property describes the full improvement and an important topics (technology, idea, constitution and estate) brand new of electroless plating (EP). the writer concentrates at the basic clinical and educational difficulties (principle, mechanism and thought) in EP today.
Based at the heritage of EP, this important reference describes plenty of new EP approaches, together with electroless Fe dependent alloy procedure deposits, formation and theoretical description of electroless alloys, microscopic concept of electroless plating deposits, microscopic buildings and floor morphology of electroless deposits, and weldability estate of electroless deposits.

  • Focus at the basic clinical and educational difficulties (principles, mechanisms and conception) in electroless plating
  • The e-book supplies a great assessment of the learn and improvement during this box and every bankruptcy is absolutely referenced
  • Detailed research and assessment of the present information, logically established for ease of use

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Extra info for Amorphous and nano alloys electroless depositions : technology, composition, structure and theory

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84] Brookshire RR, US Patent 3,046,159 Method of copper plating by chemical reduction, July 24, 1962. [85] Agens MC Jr, US Patent 3,075,855 Copper plating process and solutions, January 29, 1963. [86] John ZR, US Patent 3,095,309 Electroless copper plating, June 25, 1963. History–From the Discovery of Electroless Plating to the Present Chapter | 1 43 [87] Schneble FW Jr, McCormack JF, Zeblisky RJ, Williamson JD, Polichette J, US Patent 3,259,559 Method for electroless copper plating, July 5, 1966.

265; 1959, p. 1. Brenner A. P&SF 1984;71:24. Brenner A, Riddell GE. Plating 1947;39:385. Brenner A. Metal Finish 1954;52(11):68. 1954;52(12):61. West HJ. Metal Finish 1954;52(3):64. West HJ. Metal Finish 1954;52(7):72. West HJ. Metal Finish 1955;53(1):62. Maclean JD, Karten SM. A practical application of electroless nickel plating. ; 1954, p. 226. Gutzeit G, Mapp ET. Corr Technol 1956;5:331. Trans Inst Metal Finish 1956;33:383. Goldenstein A, Rostoker W, Schossberger F. J Electrochem Soc 1957;104:104.

However, when the thickness of the nickel layers so deposited exceeds 125 microinches, stresses within the layer cause microcracking. In this process Ni layers can be electrolessly deposited at thicknesses greater than 125 microinches, and in which the stresses are significantly lower and without microcracks. In the process the underlying layer or substrate is activated in the conventional manner. The underlying layer, for example a Mo layer, is exposed to an aqueous solution of palladium chloride.

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Amorphous and nano alloys electroless depositions : technology, composition, structure and theory by Bangwei Zhang Ph.D.

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